Hot Bar Reflow Soldering Process

For components that require a very precise positioning hot bar reflow soldering is the most ideal process.

Hot bar reflow soldering process.

The base substrate is located in a fixture and flux is applied to the pads. The flex is positioned in the parts fixture ensuring alignment of both sets of pads. In preparation for the hot bar reflow soldering process the following preparation steps need to be taken. Pulsed heated soldering differs from traditional soldering because the reflow of solder is accomplished using a heating element called a thermode which is heated and cooled down for each connection.

3 layouts for hot bar reflow soldering. Hot bar reflow soldering is a selective soldering process where two pre fluxed solder coated parts are heated using a heating element called a thermode or a hot bar to a sufficient temperature to melt the solder. The parts are then cooled below the solidification temperature to form a permanent electro mechanical bond. Pressure is applied during the entire cycle including heating reflow and cooling.