Hot Bar Soldering Design Rules

Although normal solder will melt at 180 c ideal solder temperature is above 220 c to get a good flowing and wetting behavior but below 280 c to prevent burning of the solder.

Hot bar soldering design rules.

But some materials ceramic substrates in particular need to be heated in a more controlled fashion to minimize the chance of cracking. The temperature of the stamp transfers the required heat into the joint to be soldered. 3 layouts for hot bar reflow soldering. Design tips for successful hot bar reflow.

Mobile electronics such as telecommunications equipment as well as the electronics in motor vehicles require increasing packing density and thus arrangement of the circuits in multiple layers. The parts are then cooled below the solidification temperature to form a permanent electro mechanical bond. Hot bar reflow soldering is a selective soldering process where two pre fluxed solder coated parts are heated using a heating element called a thermode or a hot bar to a sufficient temperature to melt the solder. Design tips for successful hot bar reflow soldering.

Hot bar touches the leads 400 c hot bar touches kapton or 500 c ceramics and mc pcb soldering. Flex carriers and foil connectors. The hot bar must be set higher due to the thermal transfer losses. Hot bar reflow soldering systems.

Hot bar reflow soldering. Hot bar soldering in this method resistance soldering a heated stamp also cal led bar or thermode is pressing with an adjustable programmable force on the two parts to be joined one lying on top of the other. Flex and pcb designs 1109 08 2010. Solder must be pre tinned on pcb prior to hot bar process start point for screen printing is a 150 microns thick stencil with a mask opening that results in a 40 pad coverage for small pitch applications it is recommended to pre tin the parts by electro plating as being the most accurate technology.

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